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 DISCRETE SEMICONDUCTORS
DATA SHEET
M3D891
BOTTOM VIEW
BAS16L High-speed diode
Product specification 2003 Jun 23
Philips Semiconductors
Product specification
High-speed diode
FEATURES * High switching speed: max. 4 ns * Continuous reverse voltage: max. 75 V * Repetitive peak reverse voltage: max. 100 V * Repetitive peak forward current: max. 500 mA * Leadless ultra small plastic package (1 mm x 0.6 mm x 0.5 mm) * Board space 1.17 mm2 (approx. 10% of SOT23) * Power dissipation comparable to SOT23. APPLICATIONS * General purpose switching in surface mounted circuits * Mobile communication, digital (still) cameras, PDA and PCMCIA cards.
The marking bar indicates the cathode. Bottom view
MAM471
BAS16L
DESCRIPTION The BAS16L is a high-speed switching diode fabricated in planar technology and encapsulated in a SOD882 leadless ultra small plastic package.
handbook, halfpage
Marking code: S2.
Fig.1
Simplified outline (SOD882) and symbol.
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL VRRM VR IF IFRM IFSM PARAMETER repetitive peak reverse voltage continuous reverse voltage continuous forward current repetitive peak forward current non-repetitive peak forward current square wave; Tj = 25 C prior to surge; see Fig.4 t = 1 s t = 1 ms t=1s Ptot Tstg Tj Note 1. Refer to SOD882 standard mounting conditions (footprint), FR4 printed-circuit board with 60 m copper strip line. total power dissipation storage temperature junction temperature Tamb = 25 C; note 1 - - - - -65 - 4 1 0.5 250 +150 150 A A A mW C C see Fig.2; note 1 CONDITIONS - - - - MIN. MAX. 100 75 215 500 V V mA mA UNIT
2003 Jun 23
2
Philips Semiconductors
Product specification
High-speed diode
ELECTRICAL CHARACTERISTICS Tamb = 25 C unless otherwise specified. SYMBOL VF forward voltage PARAMETER CONDITIONS see Fig.3 IF = 1 mA IF = 10 mA IF = 50 mA IF = 150 mA IR reverse current see Fig.5 VR = 25 V VR = 75 V VR = 25 V; Tj = 150 C VR = 75 V; Tj = 150 C Cd trr diode capacitance reverse recovery time VR = 0 V; f = 1 MHz; see Fig.6 when switched from IF = 10 mA to IR = 10 mA; RL = 100 ; measured at IR = 1 mA; 30 1 30 50 1.5 4 715 855 1 1.25
BAS16L
MAX.
UNIT mV mV V V nA A A A pF ns
Vfr
forward recovery voltage
when switched from IF = 10 mA; 1.75 tr = 20 ns
V
THERMAL CHARACTERISTICS SYMBOL Rth j-a Note 1. Refer to SOD882 standard mounting conditions (footprint), FR4 printed-circuit board with 60 m copper strip line. Soldering Reflow soldering is the only recommended soldering method. PARAMETER thermal resistance from junction to ambient note 1 CONDITIONS VALUE 500 UNIT K/W
2003 Jun 23
3
Philips Semiconductors
Product specification
High-speed diode
GRAPHICAL DATA
MSA562 -1
BAS16L
250 IF (mA) 200
handbook, halfpage
300
MBG382
IF (mA)
(1) (2) (3)
200 150
100 100 50
0 0 50 100 150 200 Tamb (oC)
0
0
1
VF (V)
2
Device mounted on an FR4 printed-circuit board.
(1) Tj = 150 C; typical values. (2) Tj = 25 C; typical values. (3) Tj = 25 C; maximum value.
Fig.2
Maximum permissible continuous forward current as a function of ambient temperature.
Fig.3
Forward current as a function of forward voltage.
102 handbook, full pagewidth IFSM (A)
MBG704
10
1
10-1 1 Based on square wave currents. Tj = 25 C prior to surge. 10
102
103
tp (s)
104
Fig.4 Maximum permissible non-repetitive peak forward current as a function of pulse duration.
2003 Jun 23
4
Philips Semiconductors
Product specification
High-speed diode
BAS16L
105 IR (nA) 10
4
MGA884
handbook, halfpage
0.8
MBG446
Cd (pF) V R = 75 V 0.6
103
max
75 V
0.4
10
2
25 V 0.2 typ typ
10
0 100 T j ( o C) 200 0 4 8 12 VR (V) 16
0
f = 1 MHz; Tj = 25 C.
Fig.5
Reverse current as a function of junction temperature.
Fig.6
Diode capacitance as a function of reverse voltage; typical values.
2003 Jun 23
5
Philips Semiconductors
Product specification
High-speed diode
PACKAGE OUTLINE Leadless ultra small plastic package; 2 terminals; body 1.0 x 0.6 x 0.5 mm
BAS16L
SOD882
L
L
1
2
b
e1
A A1
E
D
(2) 0 DIMENSIONS (mm are the original dimensions) UNIT mm A (1) 0.50 0.46 A1 max. 0.03 b 0.55 0.47 D 0.62 0.55 E 1.02 0.95 e1 0.65 L 0.30 0.22 0.5 scale 1 mm
Notes 1. Including plating thickness 2. The marking bar indicates the cathode OUTLINE VERSION SOD882 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 03-04-16 03-04-17
2003 Jun 23
6
Philips Semiconductors
Product specification
High-speed diode
DATA SHEET STATUS LEVEL I DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2)(3) Development DEFINITION
BAS16L
This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).
II
Preliminary data Qualification
III
Product data
Production
Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2003 Jun 23
7
Philips Semiconductors - a worldwide company
Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
(c) Koninklijke Philips Electronics N.V. 2003
SCA75
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
613514/01/pp8
Date of release: 2003
Jun 23
Document order number:
9397 750 11306


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